FPGA Carriers

• 3U VPX
• PCIExpress
• ​VC6 VME/VXS

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​Virtex - 7 FPGA Carrier Boards

​VP7: 3U VPX Digital Receiver - Virtex 7

High-Performance 3U VPX Virtex-7 FPGA Digital Receiver
Includes Quad-channel 2 Gsps ADCs or Dual-channel 4 Gsps ADC (@12-bit)

• Virtex-7 VX330T and VX690T
  
• Highest density high-speed ADC solution on the market
  
• 2 GB of DDR3 SDRAM
  
• 4 Fat Pipes (x4) at PCIe Gen3 rates
  
• FPGA Design Kit and Visualization Software Available

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VPF: 3U VPX Carrier - Virtex 7 W/FMC Site

High-Performance 3U VPX Virtex-7 FPGA Digital Receiver - Includes Quad-channel 2 Gsps ADCs or Dual-channel 4 Gsps ADC (@12-bit)

• Supports One HPC FMC Site
  
• Virtex-7 VX330T or VX690T FPGAs
  
• Air and Conduction Cooled
  
• PCI-Express Gen3 Interface
  
• FPGA Design Kit 
  
• 256MBit QSPI Flash
  
• Two Banks of 2GB DDR3 (at 667 MHz DDR)
  
• 8 Lanes GTH between FMC and FPGA.

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​VPU: 3U VPX UltraScale FPGA Carrier W/ARM Cortex A7 Processor

DEG's Newest 3U VPX FPGA Carrier

• VPX 3U Form Factor
  
• Dedicated ARM Cortex A7 Processor
  
• Kintex UltraScale: XCKU060
  
• Vita 57.1 HPC FMC Site
  
• Air and Conduction Cooled
  
• LINUX,WIN and VX Works Driver Support
  

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Whitepaper

3U VPX Digital Receiver

​Today’s Department of Defense (DoD) has a sharp focus on reducing embedded systems size, weight, power, and cost (SWaP-C) across virtually all military and aerospace applications. Now more than ever, SWaP-C technologies such as 3U VPX, demonstrate significant and measureable improvements in areas such as: sensor signal processing, increased mission life, and reduced total cost of system ownership (TCO). The performance, reliability, and modularity of the 3U VPX form factor has contributed to its emergence as the board of choice for new sensor systems and program refresh efforts.
​
In an era of DoD reduced budgets, size, weight and power reductions in electronics systems are simply not enough. The “C” for cost will need to be every bit as compelling as the technical advantages of moving to a 3U VPX system architecture. To meet this challenge, Delphi Engineering Group, Inc. (DEG) has developed a family of powerful digital receiver products that meet and exceed the DOD’s SWaP-C initiatives.

Read DEG's 3U VPX Whitepaper

Virtex - 7 FPGA / Dual FMC Sites

PC7: PCI-Express Carrier - Virtex 7

Versatile and Powerful - PCIe Virtex-7 FPGA Dual FMC Carrier 
Two HPC FMC sites with rear panel I/O

• Supports 2 HPC FMC cards with Rear I/O
  
• Virtex-7 VX330T or VX690T FPGAs
  
• Up to 9 GB of DDR3 SDRAM
  
• PCI-Express Gen3 Interface
  
• FPGA Design Kit and Visualization Software Available

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PCE-315/475 DSP Carrier With Virtex-6

Powerful XMC/PMC/FMC FPGA Carrier - 100% Duty-Cycle Capture at 3Gsps

• Supports XMC, PMC, and FMC Form Factors
  
• Virtex-6 LX130T, SX315T or SX475T FPGA
  
• Up to 16GB of DDR2 SDRAM
  
• PCI-Express Gen2 Interface
  
• FPGA Design Kit and Visualization Software Available

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PCU-085/115: PCIExpress Kintex UltraScale FPGA Carrier Board

Powerful XMC/PMC/FMC FPGA Carrier - 100% Duty-Cycle Capture at 3Gsps

• Enables High-speed Data Recording
  
• Compatible with All VITA 57.1 and VITA 57.4 FMC Modules
  
• x16 Lanes of PCIe Gen 3
  
• Kintex UltraScale: XCKU085 or 115 Options
  
• Samtec FireFly

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​Dual Virtex 6 FPGA Carrier Board

​VC6: VME/VXS Dual FPGA Board

Versatile VME/VXS Virtex 6 FPGA Carrier, Dual Virtex-6 SX475T FPGAs and Two FMC Sites

• Dual Virtex-6 SX315T/475T or LX240T/365T/550T
  
• Two FMC Sites - VITA 57.1 Compliant
  
• 1 GB DDR3 per FPGA (2 GB Total)
  
• 18 MB QDR2+ per FPGA (36 MB Total)
  
• Twelve MGT lanes between FPGAs
  
• VME2eSST Interface
  
• SERDES or PCI-Express to Optional P0 Connector
  
• FPGA Design Kit and Visualization Software Available

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